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Inter-layer Analysis for PCB Inspection – MEST Center

Date(s) - 05/19/2021
12:00 - 13:00
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Title: Inter-layer Analysis for PCB Inspection

Abstract: Robust PCB design verification and reverse engineering are often complex processes requiring tools and experienced personnel. X-ray imaging is often used in this effort for collecting and analyzing 3D volumes of the sample under test. The Auto-3D system attempts to reduce these requirements by performing automated and assisted PCB netlist extraction. The details are later combined to output a GERBER or DXF file. This training covers the following processes step by step to achieve the goal for inter layer analysis: a) X-ray parameter tuning for PCB data collection b) PCB reconstruction algorithms c) PCB data preprocessing d) Data Segmentation d) Annotating the data e) Processing a full stack of X-ray data to retrieve layer information.

Target Audience

Industry, academia, and government professionals and students.


Bookings are closed for this event.