Title: Inter-layer Analysis for PCB Inspection
Abstract: Robust PCB design verification and reverse engineering are often complex processes requiring tools and experienced personnel. X-ray imaging is often used in this effort for collecting and analyzing 3D volumes of the sample under test. The Auto-3D system attempts to reduce these requirements by performing automated and assisted PCB netlist extraction. The details are later combined to output a GERBER or DXF file. This training covers the following processes step by step to achieve the goal for inter layer analysis: a) X-ray parameter tuning for PCB data collection b) PCB reconstruction algorithms c) PCB data preprocessing d) Data Segmentation d) Annotating the data e) Processing a full stack of X-ray data to retrieve layer information.
Industry, academia, and government professionals and students.
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