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National Microelectronic Security Training Center

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M1.I: THz Imaging and Spectroscopy for Package Security and Fingerprinting

May 1, 2022 by Antonio Villarreal


Objective:  This module provides a basic understanding of using Terahertz technology (THz) to characterize the packaging of semiconductor devices for hardware assurance purposes. THz is an emerging breakthrough technology, and there are currently few commercial solutions with capabilities necessary for Hardware Assurance. The current solutions can be used in our lab to characterize authentic VS. counterfeit components and manipulated devices. The potential of using THz to extract the unique ’fingerprints’ from packaging for tracking and identification purpose will also be discussed.

Target Audience: Government officers, Scientists

Prerequisite Knowledge and Skills:

  • programming knowledge: python

Resources Provided at the Training | Deliverables:

  • Detailed description of set-ups used in training
  • A video demo of the module

Learning Outcome: In this module, trainees will learn basic understanding of using Terahertz technology (THz) to characterize the packaging of semiconductor devices for hardware assurance purposes.

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