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BEGIN:VCALENDAR VERSION:2.0 PRODID:-//wp-events-plugin.com//6.6.3//EN TZID:America/New_York X-WR-TIMEZONE:America/New_York BEGIN:VEVENT UID:166@mestcenter.org DTSTART;TZID=America/New_York:20220817T120000 DTEND;TZID=America/New_York:20220817T130000 DTSTAMP:20240725T204856Z URL:https://mestcenter.org/training/webinar-breakthrough-in-rapid-high-res olution-x-ray-tomography-of-large-pcbs-for-cad-conversion-in-reverse-engin eering/ SUMMARY:Webinar: Breakthrough in Rapid High Resolution X-ray Tomography of Large PCBs for CAD conversion in Reverse Engineering DESCRIPTION:Speaker: \nJeff Gelb\, Product Manager at Sigray\, Inc.\nAbstr act:\nReverse Engineering using 3D X-ray Tomography for conversion to CAD has been done successfully with larger industrial parts and components suc h as automotive\, aerospace\, and other industries with industrial CTs at the mm to sub mm resolution scale. It has also been demonstrated with micr o X-ray computed tomography (micro-CT) or X-ray microscopy (XRM) to severa l tens of microns resolution for PCBs and electronic components. However\, there are several drawbacks that still need to be overcome before these t ools can become mainstream for reverse engineering and construction analys is in hardware security. Limitations include the lack of resolution when i maging large samples like printed circuit boards (PCBs). While a survey sc an at low resolution may allow the main layout and components of the board to be determined\, the resolution needed to resolve some of the traces\, interconnects\, TSVs\, RDLs\, microbumps\, wire bonding often require imag ing at the submicron length scale. Most current XRMs or micro-CT scanners do not have the capability to resolve structures within a PCB to sub-micro n resolution without trimming the sample to a much smaller size. Imaging a large PCB even at a coarser resolution of several microns often takes sev eral hours for a single region of interest or could be technically impossi ble. Furthermore\, the presence of X-ray beam hardening artifacts (e.g.\, cupping\, streaks\, and bands) had been a formidable challenge. The noise caused by Surface Mount Devices (SMDs) such as Integrated Circuits (ICs)\, capacitors\, and resistors inhibits automated analysis due to their dense metallic composition relative to the PCB thin copper layers and organic s ubstrates. It makes image segmentation highly challenging and time consumi ng\, often requiring manual intervention to clean up the data before conve rsion to CAD is possible. Finally\, long X-ray exposures may damage some o f the dose-sensitive components within the electronic board.\n\nIn this we binar we describe the power of novel 3D X-ray system with a unique Angled CT architecture to solve some of the most pressing issues in reverse engin eering of PCBs. These solutions include the ability to scan large PCBs at high resolution (sub-micron) and high speed (often in minutes) without the associated beam hardening artifacts. This breakthrough together with its ability to seamlessly stitch together multiple high resolution region of i nterest scans to form a montage of the whole PCB established a workflow fo r easy and direct conversion into CAD files. We envision this will lead to the acceleration in adoption of this tool in the field of reverse enginee ring and hardware security applications.\n\n \;\nTargeted Audience:\nA pplications in Microelectronics\, Reverse Engineering\, Construction Analy sis\, Hardware and Cyber-Security\, Trojan Analysis\, Trusted Circuit Anal ysis\, Failure Analysis\, Process Development and R&\;D.\n\n \;\nIn tended learning outcomes:\nNovel Non Destructive 3 D Imaging Tools to solv e existing issues in Reverse Engineering.\n\n \;\nSpeaker Bio:\nJeff i s a product manager at Sigray in Concord\, California\, USA\, focused in X -ray microscopy. He began his career by working with X-ray diffraction ins trumentation while completing a physics degree at UC Santa Barbara. He the n became interested in multi-scale X-ray tomography through his work at Xr adia and\, later\, ZEISS. Jeff completed a Master's degree in materials en gineering at San Jose State in 2017\, with a research focus in developing non-destructive characterization routines for lithium-ion battery analysis using micro-CT. With his move to Sigray\, Jeff is excited about the futur e of laboratory X-ray characterization\, leveraging modern advancements in data analysis tools for automating powerful 3D workflows. \n \nZoom Infor mation:\nJoin Zoom Meeting\nhttps://ufl.zoom.us/j/904047693\n\nMeeting ID: 904 047 693\n\nOne tap mobile\n+16465588656\,\,904047693# US (New York)\n +16699006833\,\,904047693# US (San Jose)\n\nDial by your location\n+1 646 558 8656 US (New York)\n+1 669 900 6833 US (San Jose)\nMeeting ID: 904 047 693\nFind your local number: https://ufl.zoom.us/u/ab5VOI6m6G\n\nJoin by SIP\n904047693@zoomcrc.com\n\nJoin by H.323\n162.255.37.11 (US West)\n162. 255.36.11 (US East)\n221.122.88.195 (China)\n115.114.131.7 (India Mumbai)\ n115.114.115.7 (India Hyderabad)\n213.19.144.110 (EMEA)\n103.122.166.55 (A ustralia)\n209.9.211.110 (Hong Kong)\n64.211.144.160 (Brazil)\n69.174.57.1 60 (Canada)\n207.226.132.110 (Japan)\nMeeting ID: 904 047 693\n\nJoin by S kype for Business\nhttps://ufl.zoom.us/skype/904047693 ATTACH;FMTTYPE=image/jpeg:https://mestcenter.org/wp-content/uploads/2022/0 8/J.jpg CATEGORIES:Home Page,Webinars END:VEVENT BEGIN:VTIMEZONE TZID:America/New_York X-LIC-LOCATION:America/New_York BEGIN:DAYLIGHT DTSTART:20220313T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 TZNAME:EDT END:DAYLIGHT END:VTIMEZONE END:VCALENDAR