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TZID:America/New_York
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BEGIN:VEVENT
UID:166@mestcenter.org
DTSTART;TZID=America/New_York:20220817T120000
DTEND;TZID=America/New_York:20220817T130000
DTSTAMP:20240725T204856Z
URL:https://mestcenter.org/training/webinar-breakthrough-in-rapid-high-res
olution-x-ray-tomography-of-large-pcbs-for-cad-conversion-in-reverse-engin
eering/
SUMMARY:Webinar: Breakthrough in Rapid High Resolution X-ray Tomography of
Large PCBs for CAD conversion in Reverse Engineering
DESCRIPTION:Speaker: \nJeff Gelb\, Product Manager at Sigray\, Inc.\nAbstr
act:\nReverse Engineering using 3D X-ray Tomography for conversion to CAD
has been done successfully with larger industrial parts and components suc
h as automotive\, aerospace\, and other industries with industrial CTs at
the mm to sub mm resolution scale. It has also been demonstrated with micr
o X-ray computed tomography (micro-CT) or X-ray microscopy (XRM) to severa
l tens of microns resolution for PCBs and electronic components. However\,
there are several drawbacks that still need to be overcome before these t
ools can become mainstream for reverse engineering and construction analys
is in hardware security. Limitations include the lack of resolution when i
maging large samples like printed circuit boards (PCBs). While a survey sc
an at low resolution may allow the main layout and components of the board
to be determined\, the resolution needed to resolve some of the traces\,
interconnects\, TSVs\, RDLs\, microbumps\, wire bonding often require imag
ing at the submicron length scale. Most current XRMs or micro-CT scanners
do not have the capability to resolve structures within a PCB to sub-micro
n resolution without trimming the sample to a much smaller size. Imaging a
large PCB even at a coarser resolution of several microns often takes sev
eral hours for a single region of interest or could be technically impossi
ble. Furthermore\, the presence of X-ray beam hardening artifacts (e.g.\,
cupping\, streaks\, and bands) had been a formidable challenge. The noise
caused by Surface Mount Devices (SMDs) such as Integrated Circuits (ICs)\,
capacitors\, and resistors inhibits automated analysis due to their dense
metallic composition relative to the PCB thin copper layers and organic s
ubstrates. It makes image segmentation highly challenging and time consumi
ng\, often requiring manual intervention to clean up the data before conve
rsion to CAD is possible. Finally\, long X-ray exposures may damage some o
f the dose-sensitive components within the electronic board.\n\nIn this we
binar we describe the power of novel 3D X-ray system with a unique Angled
CT architecture to solve some of the most pressing issues in reverse engin
eering of PCBs. These solutions include the ability to scan large PCBs at
high resolution (sub-micron) and high speed (often in minutes) without the
associated beam hardening artifacts. This breakthrough together with its
ability to seamlessly stitch together multiple high resolution region of i
nterest scans to form a montage of the whole PCB established a workflow fo
r easy and direct conversion into CAD files. We envision this will lead to
the acceleration in adoption of this tool in the field of reverse enginee
ring and hardware security applications.\n\n \;\nTargeted Audience:\nA
pplications in Microelectronics\, Reverse Engineering\, Construction Analy
sis\, Hardware and Cyber-Security\, Trojan Analysis\, Trusted Circuit Anal
ysis\, Failure Analysis\, Process Development and R&\;D.\n\n \;\nIn
tended learning outcomes:\nNovel Non Destructive 3 D Imaging Tools to solv
e existing issues in Reverse Engineering.\n\n \;\nSpeaker Bio:\nJeff i
s a product manager at Sigray in Concord\, California\, USA\, focused in X
-ray microscopy. He began his career by working with X-ray diffraction ins
trumentation while completing a physics degree at UC Santa Barbara. He the
n became interested in multi-scale X-ray tomography through his work at Xr
adia and\, later\, ZEISS. Jeff completed a Master's degree in materials en
gineering at San Jose State in 2017\, with a research focus in developing
non-destructive characterization routines for lithium-ion battery analysis
using micro-CT. With his move to Sigray\, Jeff is excited about the futur
e of laboratory X-ray characterization\, leveraging modern advancements in
data analysis tools for automating powerful 3D workflows. \n \nZoom Infor
mation:\nJoin Zoom Meeting\nhttps://ufl.zoom.us/j/904047693\n\nMeeting ID:
904 047 693\n\nOne tap mobile\n+16465588656\,\,904047693# US (New York)\n
+16699006833\,\,904047693# US (San Jose)\n\nDial by your location\n+1 646
558 8656 US (New York)\n+1 669 900 6833 US (San Jose)\nMeeting ID: 904 047
693\nFind your local number: https://ufl.zoom.us/u/ab5VOI6m6G\n\nJoin by
SIP\n904047693@zoomcrc.com\n\nJoin by H.323\n162.255.37.11 (US West)\n162.
255.36.11 (US East)\n221.122.88.195 (China)\n115.114.131.7 (India Mumbai)\
n115.114.115.7 (India Hyderabad)\n213.19.144.110 (EMEA)\n103.122.166.55 (A
ustralia)\n209.9.211.110 (Hong Kong)\n64.211.144.160 (Brazil)\n69.174.57.1
60 (Canada)\n207.226.132.110 (Japan)\nMeeting ID: 904 047 693\n\nJoin by S
kype for Business\nhttps://ufl.zoom.us/skype/904047693
ATTACH;FMTTYPE=image/jpeg:https://mestcenter.org/wp-content/uploads/2022/0
8/J.jpg
CATEGORIES:Home Page,Webinars
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DTSTART:20220313T030000
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