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MEST Center

National Microelectronic Security Training Center

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Ohio State University (OSU)

November 17, 2023 by Limor Herb
Phase 3, year 1 | Phase 3, year 2 || Phase 3 year 3 || Phase 3 year 4 |
Phase 3, year 1

Courses

Course IDCourseDeadlineReceived
C6Introduction to Printed Circuit Board Design11/30/202301/16/2024
C8Asynchronous Design Practices for Secure Hardware12/29/2023
C9Fundamentals of Chip-to-Chip Interconnect2/01/202402/12/2024
C12Fundamentals of Digital IC Design: From RTL to GDSII2/28/2024
C13ChipCraft: The Art of Chip Design for Non-Experts (with E-Fabless)3/29/202401/12/2024
C14Introduction to Integrated Circuit Packaging and Assembly11/30/202301/16/2024
Phase 3, year 2

Courses

Course IDCourseDeadlineReceived
C15Fundamentals of Digital IC Design: From RTL to GDSII09/16/202408/12/2024
C16Introduction to Printed Circuit Board Design01/13/202509/10/2024
C17ChipCraft: The Art of Chip Design12/02/202403/31/2025
C18Recommended Learning Journey for a Digital Designer through Synopsys Self-Paced Learning12/23/202403/31/2025
C19From Silicon to Systems: The Art of Digital Semiconductor Verification and Software Development3/24/2025
Phase 3, year 3

Courses

Course IDCourseDeadlineDate of training
C20Introduction to Printed Circuit Board Design​01/13/2026
C21Fundamentals of Digital IC Design: From RTL to GDSII12/01/2025
C22(Siemens) Hardware Emulation: How to Verify a Complex SoC
C23(Siemens) Pre-Silicon Verification in Practice: From RTL to UVM Testbenches:​
01/19/2026
C24RF Power Amplifier Techniques using GaAs, and GaN semiconductors01/13/2026
Phase 3, year 4

Courses

Course IDCourseDeadlineDate of training
C25Advanced Packaging & STCO – Part I7/6/2026
C26Advanced Packaging & STCO – Part II8/17/2026
C27Introduction to Integrated Circuit Packaging and Assembly8/24/2026
C28Modeling and Verification of Analog and Mixed Signal ICs from Concept to Post Layout Simulation:​
10/6/2026
C29
C30
Category: Phase 3
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