Chip Imaging

Instructor 

Dr. Navid Asadi is an Associate Professor in the Electrical and Computer Engineering Department at the University of Florida with an affiliation to the Materials Science and Engineering Department.

Learning Objectives

This micro-certificate provides a comprehensive exploration of chip imaging techniques, from fundamental optical resolution to advanced electron and terahertz methods. Participants will begin by learning how resolution, texture, and optical principles set the foundation for imaging and defect detection. The course then covers scanning electron microscopy (SEM), with emphasis on system operation, vacuum conditions, calibration, and compositional mapping. Learners will further explore X-ray tomography, a powerful nondestructive method for reconstructing multilayer structures and identifying internal defects. Finally, the course introduces near-field terahertz imaging, which provides unique capabilities for material and structural characterization beyond the limits of traditional methods. By combining theory, practical demonstrations, and case-based learning, participants will gain the skills to operate different imaging systems, interpret results, and apply these methods for hardware assurance, counterfeit detection, and failure analysis in electronics.

In this certificate course, students will learn fundamental and advanced techniques for imaging integrated circuits and electronic components, including optical, electron, X-ray, and terahertz approaches.

This micro-certificate course is organized into four units described below:

• Unit 1: Resolution & Texture: Learn how optical resolution, diffraction, and texture analysis affect image quality and defect visibility. Explore parameters such as point spread function (PSF) and numerical aperture (NA), and their impact on defect detection accuracy.
• Unit 2: Scanning Electron Microscopy (SEM): Gain practical knowledge of SEM operation, including chamber vacuum conditions, beam control, calibration, and surface texture mapping. Learn how SEM imaging reveals counterfeit signatures such as recoating, sanding, or material inconsistencies.
• Unit 3: X-ray Tomography: Study nondestructive X-ray imaging for internal inspection of chips and PCBs. Learn how projection, reconstruction, and visualization steps work, and how tomography enables structural analysis of multilayer boards.
• Unit 4: Near-Field Terahertz Imaging: Explore near-field terahertz time-domain spectroscopy (THz-TDS) and its applications in non-destructive material and structural characterization. Learn how THz imaging detects voids, polymer variations, and counterfeit encapsulants.
• Unit 5: Supplemental Lectures

Learning Outcomes:

Upon successful completion, participants will be able to:

• Explain the role of resolution, texture, and optical parameters in image formation and defect analysis.
• Operate SEM systems effectively, maintaining proper vacuum and calibration while capturing high-quality images.
• Apply X-ray tomography to reconstruct 3D models of internal chip/PCB structures and detect hidden defects.
• Utilize near-field terahertz imaging to perform nondestructive material and structural characterization.
• Compare the strengths and limitations of optical, electron, X-ray, and terahertz imaging methods in hardware assurance.

Prerequisites:

• General: Fundamentals of physics and electronics (optics, materials)
• Helpful: Prior completion of “Resolution & Texture” or similar introductory microscopy training
• Optional: Programming skills (Python/MATLAB) for image analysis exercises

Target Audience

Designed for professionals working in the Department of War / Government, government-affiliated employees, industry, as well as college students and faculty. Participants must register with their organizational email and will be notified of acceptance within one week of the course start date.

Biography

Navid Asadi is an Associate Professor in the Electrical and Computer Engineering Department at the University of Florida with an affiliation to the Materials Science and Engineering department. He investigates novel techniques for electronics inspection and assurance, system and chip level decomposition and security assessment, anti-reverse engineering, 3D imaging, invasive and semi-invasive methods, supply chain security, etc. Dr. Asadi is director of the Security and Assurance (SCAN) lab house to more than $12M advanced imaging and characterization equipment. He also serves as the associate director of the Florida Semiconductor Institute (FSI), and the Microelectronics Security Training (MEST) center which is a multi-million dollar program to train and reskill the professional engineers in the area of security. Dr. Asadi  has received his NSF CAREER award in 2022 and several best paper awards from IEEE International Symposium on Hardware Oriented Security and Trust (HOST) and the ASME International Symposium on Flexible Automation (ISFA). He was also winner of D.E. Crow Innovation award from University of Connecticut. He is also the general chair of the IEEE Physical Assurance and Inspection of Electronics (PAINE) Conference. His projects are sponsored by various government agencies and industry including but not limited to NSF, AFRL, AFOSR, ONR, SRC, Meta, Cisco, Analog Devices, etc.