6-hour course introduces students to the world of integrated circuit (IC) packaging and assembly including consideration of the impact of packaging on system performance and reliability.
Dr. Shane Smith (Ph.D., Electrical and Computer Engineering, The Ohio State University) is a Research Scientist at the Ohio State University ElectroscienceLab and President and co-founder of SenseICs Corporation. Shane has worked for more than 20 years designing, producing, and maintaining electronic systems used in integrated circuit research, high energy physics experiments (CERN, Stanford linear accelerator, etc.), and other applications. Shane’s broad expertise covers a range of electrical engineering activities including the design and development of radiation hard mixed signal ASICs, FPGA based data acquisition systems, medical imaging electronics, chemical vapor deposition diamond detectors, and high voltage power supply systems. Additionally, his academic publications, which include more than 80 peer-reviewed conference papers and journal articles, have been cited more than 20,000 times.
Registration is open to DoD, Government, and Government-affiliated employees only.
Register with your organizational email and we’ll let you know about acceptance within one week prior to class start.
March 11, 2024 – March 21, 2024
Monday and Thursday from 4PM until 5:30PM
Synchronous over Zoom