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MEST Center

National Microelectronic Security Training Center

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M1.D: Counterfeit IC Detection Using Optical Imaging

May 1, 2022 by Antonio Villarreal


Objective: The learning objective of this module is for trainees to gain hands-on experience on counterfeit IC detection through physical inspection using optical image analysis. Trainees will learn to acquire optical images of IC packages using different modalities such as a digital microscope, a stereo microscope, and a DSLR camera and lighting setup. A counterfeit IC may often contain one or more different anomalies and deviations from the normal/usual form and/or functionality of a genuine IC (often called ‘Golden IC’). These anomalies may be physical (i.e., related to the leads, package, etc.) or electrical (e.g., degradation in its performance or a change in its specifications). This manual demonstrates how to perform detailed External Visual Inspection (EVI) for counterfeit IC detection using the previously mentioned image acquisition modalities and image analysis.

Target Audience: Government officers, Scientists

Prerequisite Knowledge and Skills:

  • programming knowledge: python
  • IC design flow steps

Resources Provided at the Training | Deliverables:

  • Detailed description of set-ups used in training
  • A video demo of the module

Learning Outcome: This lab manual will help in learning how to use DSLR setup, Leica DVM6 Digital Microscope and Leica LAS X software, and ZEISS Stemi 508 Stereo Microscope and Zeiss Zen Core v3.2 Software for image acquisition. With the acquired images and applying proper color correction method using color checker and color normalization technique, this experiment will help in learning how to apply different basic image processing techniques (along with extracting different geometric information of the package surface) on the acquired optical images to identify counterfeit IC.

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