Introduction to Integrated Circuit Packaging and Assembly

Course Description

This 6-hour course introduces the structures, materials, and processes used to package integrated circuits. Participants will learn how wafers and die become finished components through dicing, die attach, wire bonding, flip-chip bonding, solder bumping, underfill, encapsulation, lid attach, and package marking. The course also introduces common package types, including plastic encapsulated, ceramic/hermetic, BGA, chip-scale, and metal-lidded flip-chip packages.

Course Details

The course is designed for a broad technical audience, including students, researchers, engineers, government personnel, defense contractors, failure analysts, materials analysts, counterfeit detection specialists, and professionals working with microelectronic components or systems. General familiarity with electronics, microelectronics, materials, or hardware systems is helpful, but no prior IC packaging experience is required. Topics include IC package functions, common package types, wafer-to-package assembly, wire bonding, flip-chip assembly, BGAs, lead frames, substrates, solder balls, underfill, encapsulants, lids, package markings, materials selection, reliability considerations, and emerging 2.5D/3D packaging approaches.

Learning outcomes

Participants will be able to identify major IC package types, describe how packaged components are assembled, recognize key package layers and materials, compare wire-bonded, flip-chip, BGA, ceramic, plastic, and metal-lidded package structures, explain how packaging materials affect performance and reliability, and understand common package marking approaches used for traceability, inspection, and component identification.