Introduction to Integrated Circuit Packaging and Assembly

Abstract

This course provides a practical introduction to integrated circuit packaging and assembly, explaining how semiconductor die are transformed into reliable, usable electronic components. Participants will be introduced to common and advanced package types, package materials, interconnect methods, assembly processes, and marking techniques.

Instructor

Dr. Shane Smith (Ph.D., Electrical and Computer Engineering, The Ohio State University) is a Research Scientist at The Ohio State University Electroscience Lab and President and co-founder of SenseICs Corporation. Shane has worked for more than 25 years designing, producing, and maintaining electronic systems used in integrated circuit research, high-energy physics experiments at CERN and the Stanford Linear Accelerator Center, and other applications. His broad expertise covers a range of electrical engineering activities, including the design and development of radiation-hard mixed-signal ASICs, FPGA-based data acquisition systems, medical imaging electronics, chemical vapor deposition diamond detectors, and high-voltage power supply systems. Additionally, his academic publications, which include more than 80 peer-reviewed conference papers and journal articles, have been cited more than 20,000 times.

Target Audience

Designed for U.S. citizens working in the Department of War, Government, or Government-affiliated employees, industry, as well as college students and faculty. Must register with your organizational email, and will be notified of acceptance within one week of the course start date.

Course Details

August 24, 2026 – September 21, 2026

Course dates:
August 24, 2026
August 31, 2026
September 14 2026
September 21, 2026

Mondays from 4:00 PM until 5:30 PM

Synchronous over Zoom

6 hours | 4 weeks | 1.5-hr lectures once a week

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